Used SHINKAWA UTC-1000 #293662513 for sale

SHINKAWA UTC-1000 is a full-featured bonder developed by SHINKAWA Electric Co., Ltd. It is a high-end bonder, often used in precision electronic and semiconductor device assembly. It is a unique equipment designed specifically for the placement of ultra-tiny size components and has higher accuracy precision than most other bonders on the market. SHINKAWA UTC1000 features a high quality camera system, sensitive scanning elements, high-speed image processing, and advanced AI (Artificial Intelligence) functions. Using UTC 1000 to bond high precision components is far simpler than hand soldering. It quickly and accurately places components of sizes as small as 0.2mm and is capable of bonding them with a high repeatability rate, up to ±20 μm accuracy on X and Y axes. The device can place components at speeds up to 30,000 chips/hour. Furthermore, the custom-made high-speed scanning mechanism used for recognizing the position and size of the component allows for accurate placement. SHINKAWA UTC 1000 also includes user-friendly features such as routing and shape recognition, which enables it to align components in the designated place. The device is also designed to reduce the need for manual adjustments, as the built-in lapping system ensures that components are placed precisely on the circuit board without slipping out of place. In addition, the device is equipped with an auto-moisture checker, which is essential for preventing heat damage and moisture-related defect. This system checks temperature and humidity levels every 10 seconds and it has a temperature correction function to help maintain a precise temperature during the bonding process. Ultimately, UTC1000 provides a reliable, accurate, and cost-effective solution for assembling ultra-tiny size components, making it an essential tool in the manufacturing industry. This device offers users convenience, flexibility, and improved efficiency for a variety of precision bonding projects.