Used SHINKAWA UTC-1000 #293810626 for sale

SHINKAWA UTC-1000 is a fully automated wire, ribbon, and tube bonding machine ideal for a wide range of production needs. This machine offers a variety of bonding techniques, including ultrasonic, thermocompression, thermosonic, laser, reflow, and wedge. With its integrated micro-processor, SHINKAWA UTC1000 has the ability to automatically detect the optimum bonding parameters for each individual application. The machine also offers programmable acceleration and deceleration options, ensuring a fast and reliable bond. UTC 1000 has a dual-station bond head, which enables it to work on two different processes at the same time. This feature helps to maximize productivity and reduce downtime associated with switching between bonds. The machine is also equipped with two bond heads enabling it to carry out double-side bonding operations concurrently. It also features precise pressure control, adjustable wire length, and feed rate, offering superior bond accuracy. The integrated laser thermocompression technique utilizes a laser heat source for faster bonding rates, providing an ideal solution for high quality bondings. UTC-1000 offers a number of advanced features such as dual lasers, programmable laser power control, wire preheat, and vacuum feed. The integrated dual lasers enable the machine to detect and remediate any potential issues during the bonding process, resulting in a stronger, more reliable bond. The programmable laser power control feature allows the machine to adjust its laser power based on the application's requirements, which helps to reduce process time and cost. Furthermore, the vacuum feed enables the machine to capture wire strands at a high speed, while the wire preheat ensures a uniform bond temperature. UTC1000 provides an efficient and reliable solution for various wire bond related requirements. Its integrated micro-processor allows it to control a variety of aspects in bonding operations, and its dual-station heads provide faster processing times. Additionally, its advanced features such as dual lasers, programmable laser power control, wire preheat, and vacuum feed help improve accuracy and quality of bondings. Its versatile design and capabilities make SHINKAWA UTC 1000 an ideal choice for a wide range of wire bonding needs.