Used SHINKAWA UTC-1000 #293810628 for sale

SHINKAWA UTC-1000 bonder is a versatile and reliable piece of equipment necessary for bonding a variety of materials and substrates. SHINKAWA UTC1000 is a fully automatic, compact bonder with features that include a built-in bonding press, temperature control, and a vacuum platform for pick-and-place operations. The machine utilizes an ultrasonic welding technology to produce reliable bonds that are ideal for precision parts in the medical device and aerospace industries, as well as for creating general automotive parts. UTC 1000 bonder consists of a sturdy and enclosed weld frame that is equipped with an x-y-z lift table, with an x-arm attached to the z-axis. The z-axis also has an automated positioning and welding system. The control panel comes with screens that display easy-to-read actuator system parameters, including temperature and current levels, cycle times, and bond progress. UTC1000 bonder is equipped with a series of anvils and grippers that contribute to the accuracy and durability of the bonds produced. The anvils use pre-set parameters to ensure consistency, whereas the grippers provide greater control for a wide variety of materials, including flexible plastics, thin metals, and thicker metals. The gripping pressure can be adjusted based on the material and application. UTC-1000 bonder has a built-in welding press that is capable of creating strong and durable bonds that are necessary for manufacturing applications in the medical device and aerospace industries. The built-in press is adjustable, and the welding pressure is displayed in kLf/cm2. The welding range is adjustable to ensure that the bond creates a secure connection between the two substrates. SHINKAWA UTC 1000 bonder also has a built-in temperature controller that ensures that the welding process occurs at optimal temperatures for higher-quality bonds. The temperature controller monitors the heat input during welding, and the set temperature can be adjusted. SHINKAWA UTC-1000 bonder also features a vacuum platform for pick-and-place operations. This provides a convenient process for aligning and placing two substrates on the welding table to ensure a precise bond. The bonded substrates are automatically placed on the platform and clamped in place for the welding process. The vacuum platform provides greater precision and reliability during the bonding process. SHINKAWA UTC1000 bonder is an efficient and reliable machine that offers a variety of features to ensure that the bonds it creates are strong and durable enough for a variety of precision parts in the medical device and aerospace industries. It is equipped with an x-y-z lift table, an adjustable welding press, a built-in temperature controller, and a vacuum platform, making it a cost-effective and functional piece of equipment that is essential for the manufacturing of parts that require strong, reliable bonds.