Used SHINKAWA UTC-1000 #293810652 for sale

SHINKAWA UTC-1000 is a high-precision and high-capacity desktop wire bonder manufactured by SHINKAWA Electric Co. Ltd. This bonder is suitable for manufacturing and assembling intricate and delicate semiconductor packages, such as ball grid arrays (BGA) and microelectromechanical systems (MEMS). This desktop bonder is powered and controlled by DC motor and utilizes the proven sub-micron looping accuracy of SHINKAWA patented SIC-USA (Stable and Instantaneous Control) control system. SHINKAWA UTC1000 also features a high-resolution closed-loop cameras and stepper motor-driven X-Y adjustment table for accurate alignment of the looping and interconnecting process. In terms of operational performance, UTC 1000 is capable of bonding wires in stainless, copper, gold, and aluminium with diameters ranging from 0.01 mm to 0.1 mm. This bonder can produce consistent loop and interconnect accuracies of up to 1 µm and maximum feeds speeds of up to 365 ppm. It also offers material loading features for single and multiple wire types. Moreover, UTC-1000 is equipped with a user-friendly intuitive graphical user interface, allowing an operator to set up and control parameters easily. The bonder also provides process profiles that help to obtain repeatable and reliable bonding results. It also has an external 3-axis driver for welding and soldering, as well as the capability to simultaneously bond multiple bonded points. Overall, SHINKAWA UTC 1000 features the most advanced technologies and is an ideal machine for any semiconductor packaging process. With its high performance, flexible programming interface, and robust safety features, this bonder is an excellent choice for precise and intricate semiconductor packaging applications.