Used SHINKAWA UTC-1000 #293810665 for sale

SHINKAWA UTC-1000
Manufacturer
SHINKAWA
Model
UTC-1000
ID: 293810665
Vintage: 2012
Wire bonders 2012 vintage.
SHINKAWA UTC-1000 is a fully automated high-precision bonder machine designed to manufacture the world's most accurate bonded assemblies for demanding applications. SHINKAWA UTC1000 utilizes a precise stage movement equipment and proprietary sealed high-purity atmosphere to reduce contamination for repeatable and reliable results. The bonder is capable of a wide range of ultra-fine bonding processes using a range of techniques, including thermocompression bonding, ultrasonic bonding, resistance welding, and laser bonding. UTC 1000 is a highly automated bonder, featuring an integrated PC-based machine control system, a real-time auto centering and alignment unit, as well as real-time camera monitoring. The bonder machine includes a powerful range of optional auxiliary functions, such as advanced job memory, process registration machine, break detection tool, and particle detection asset. The industrial-grade bonder is designed to improve productivity and yield, and features a repeatability of 0.003mm, bringing reliability for high quality products. SHINKAWA UTC 1000's advanced vacuum table work-piece staging model provides precise control over work pieces and ensures that the product maintains its position during the required steps. The bonder's process parameters can be adjusted with the help of intuitive remote operation panels and full PC control, which allows customers to customize their bonding process to their specific production needs. UTC-1000 also offers high temperature bond control, adjustable temperature control range, and adjustable current control. UTC1000 has superior environmental parameters with temperature and humidity monitoring capability. A sealed high-purity atmosphere is achieved by a built-in filtration equipment, preventing contamination of the bonder, and therefore ensuring reliable and repeatable results. This system also helps to prevent dust particles from entering the bonding machine, and the sealed high-purity atmosphere adds longevity to SHINKAWA UTC-1000. Overall, SHINKAWA UTC1000 is an industrial grade high-precision bonder designed to create world-class bonded assemblies. It features a variety of features including advanced job memory, process registration unit, break detection machine, particle detection tool, as well as adjustable process parameters. Its built-in filtration asset allows for both a sealed high-purity atmosphere and dust-free environment to ensure high-quality production. UTC 1000 is capable of fast cycles, repeatability of 0.003mm, and temperature and humidity monitoring capability for reliable and repeatable results.
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