Used SHINKAWA UTC-1000 #293810666 for sale

SHINKAWA UTC-1000 is a highly advanced and one of the most versatile bonders on the market today. This bonder is designed to provide precision and accuracy for applications requiring ultra-fine wires and other micro-line bonding. The unit has a unique Digital Twin servo (DTS) mechanism which consists a two-axis drive equipment utilizing a U-frame base and air bearing drive. This allows for a wide range of motion and precise XYZ motion control. SHINKAWA UTC1000 can perform both low and high speed wire bonding runs simultaneously for increased throughput. UTC 1000 has up to 24 feeder mechanisms which are capable of processing most types of wires from 0.01 to 0.15 mm in diameter. The unit also includes a micro-flexible thermal chuck and an up/down motion for improved access to challenging application areas. The bonder also has a fully automated warm-up and cool-down process and can be programmed with various parameters such as bond pressure, power, temperature, time, and wire sequence for complete control. UTC-1000 is designed to meet the most demanding requirements. It has a compact size and ergonomic design for easy accessibility to work areas. The machine has an intuitive graphical touch screen interface which makes setup and operation easy. The bonder also has advanced diagnostics system and advanced temperature control capabilities to help ensure that the unit is always optimally performing. The unit also has built-in safety features such as a double power cut protection unit and an internal ventilation machine to protect the unit against overheating and ESD damage. This is an ideal choice for operating in industrial environments where durability, precision, and quality are paramount. SHINKAWA UTC 1000 is highly reliable and efficient in producing high-quality, ultra-fine wire bonds. It is the perfect tool for customers who are looking to take their bonding processes to the next level of excellence.