Used SHINKAWA UTC-1000 #293810668 for sale

SHINKAWA UTC-1000 is a precision bonder, a type of machine used to join two or more materials by welding or adhering them together. It is primarily used in thermally-actuated bonding applications such as flip chip and solderdie, as well as for LCD attachment and motion control. SHINKAWA UTC1000 is a fully automated equipment, offering high accuracy, productivity and programmability through its versatile controller. UTC 1000 features a precisely controlled, servo-driven vertical motion system that is capable of operating at up to 9 mm/s with an accuracy rating of 50 nanometers. This allows for high throughput and high yield bond processes that are perfect for complex, high-precision applications. The bonder also features a precision digital temperature controller that ensures a precise thermal profile during the bonding process. The unit also has multiple safety features including temperature limits, heat monitoring, and emergency stop functionality. UTC-1000 is capable of operating with a variety of materials due to its integrated vision machine and automated set-up parameters. This allows for fast and accurate bond processes that can be programmed and stored for future use. This makes it possible for the bonder to be used for multiple projects and processes, allowing for greater flexibility and increased cost savings. The device also features advanced parameters such as dwell time, energy, pressure, including both static and dynamic adjustments. Additionally, the programmable vision tool can perform quality checks, such as gap and alignment measurements of the bond in real time. Overall, UTC1000 provides superior performance, accuracy, and flexibility. It is an ideal solution for a range of thermally-actuated bonding applications, providing for quick turnaround times and high yields with low downtime. With its versatile features and integrated vision asset, SHINKAWA UTC 1000 is a perfect choice for high-precision bonding applications.