Used SHINKAWA UTC-1000 #9000828 for sale

SHINKAWA UTC-1000 is a fully automated, computer-controlled bonder specifically designed to improve the efficiency and accuracy of the bonding process across a variety of industries. This device is capable of accurately joining two items, such as a chip and a substrate, with a precision of 5 micrometers. It utilizes a robust, computer-programmable, multi-stage bonding process that eliminates the need for manual configuration and labor-intensive setup. The machine comes equipped with a high-power xenon arc lamp to ensure uniform heating across the target area. This feature is critical for achieving the level of exquisite heat control needed for reliable and repeatable bonds. The device is also designed with a sophisticated imaging system that utilizes state-of-the-art optics to capture precise two-dimensional and three-dimensional images of the bonding area. The system is capable of detecting latent defects or subtle surface inconsistencies. SHINKAWA UTC1000 is also equipped with an advanced control program that helps to ensure the accuracy of the bonding process. This program is designed to provide real-time feedback on the state of the process, resulting in greater control and regular optimization. In addition to this, the device is also equipped with a variety of programmable settings and fine-tuning options in order to meet the needs of the specific application. This bonder is perfect for use in the most exacting industries, such as the medical industry. Thanks to the precision offered by the device, it is capable of forming accurate and reliable bonding with a variety of substrates, Ultra Thin Substrates (UTS) and Wafers-on-Wafer (WoW). It is also capable of working with a variety of metallic conductive materials such as copper, gold, silver, and zinc, meaning that it can join objects with different electrical properties. The device is outfitted with a series of intuitive user interfaces and features that make it easy to operate. It is designed to be friendly to novice and experienced operators alike, offering a configuration and operation that can be quickly mastered. Additionally, performance-related data measurements can be easily accessed and interpreted, providing feedback that further improves the reliability of the bonding process. On top of all this, UTC 1000 is designed to be exceptionally energy efficient, making it highly desirable from an environmental standpoint. It is also highly reliable and aesthetically pleasing, making it suitable for a variety of industries and applications. With its robust design and intuitive controls, this bonder promises to provide reliable and repeatable bonds for years to come.