Used SHINKAWA UTC-1000 #9097296 for sale

SHINKAWA UTC-1000 is a precision semiconductor bonder designed to provide high throughput and reliability to semiconductor packaging applications. It is a fully-automated, high-precision equipment that features high-speed bonding and precise temperature control for maximum reliability in the production process. The bonder utilizes a range of bond heads such as the capacitance lead bonder and infrared die bonder to successfully complete the bonding process. SHINKAWA UTC1000 can bond active and passive components with speeds of up to 5000 cycles per second and is capable of handling components with pitches down to 0.1mm. The system ensures highly accurate and reliable bonding by using temperature controllers, which allow the operator to set the application's parameters and adjust the temperate, as well as sophisticated z-axis control for precise placement of leads and components. Thanks to its powerful vision control, the unit is able to accurately determine position and placement of components. The bonder is equipped with advanced detachable rotating tables, that enable automatic loading and unloading of wafers and chips. This enables the machine to achieve maximum throughput and higher production volumes. The tool boasts excellent reliability and repeatability, providing efficient and cost-effective production cycles for a variety of component sizes. UTC 1000 offers a suite of maintenance features, including a feature that allows operators to check bonding conditions from the outside of the machine, as well as a built-in self-diagnosis function and an easy-access cleaning door. The asset also offers regular performance-monitoring, to enable early detection of problems and preventive maintenance. UTC1000 is an advanced and reliable semiconductor bonder that offers a wide range of features designed to improve accuracy and reliability in the production process. With a suite of maintenance features and self-diagnosis functions, the bonder is able to ensure maximum throughput and cost-effectiveness in production, making it the perfect choice for a variety of semiconductor packaging applications.