Used SHINKAWA UTC-1000 #9099965 for sale

SHINKAWA UTC-1000 is a high-precision surface mount bonder ideal for applications in the automotive, aerospace, and electronics industries. This fully automated, temperature-controlled bonder can handle a variety of surface mount components from 0.1 mm pitch packages to larger components up to 4x4 inches. It has a reliable, solid state vision system for accurate placement of SMT devices onto the substrate and uses an advanced design for high reliability and repeatability. Its state-of-the-art control system ensures that the heater and bondhead are precisely aligned during assembly. SHINKAWA UTC1000 is designed to work at high rates of speed and precision. Its heated bondhead allows quick and accurate heating and cooling cycles in the assembly process. With an automated temperature controller and adjustable pressure adjustment, the bonder is capable of controlling and fine-tuning the temperature and pressure of the bonder head during bonding. The bonder is designed for a variety of applications. UTC 1000 can be configured to handle lead-free soldering as well as traditional Pb-Sn alloys. It is also capable of high-temperature operations for lead-free soldering of Sn-Ag-Cu lead-free solders. The bonder offers superior accuracy and process control for wire-bond die attach, as well as epoxy-dispensing and underfilling. UTC1000 is equipped with digital video cameras with cross-sectional imaging capability and advanced microscopes for precise alignment. The bonder offers high throughput and accurate placement for a range of SWIR and E-beam die bonds, metal lids and wires, application of adhesives and pastes, and printable dot-matrix circuits. It has adjustable heater elements and a large bondhead area with a choice of shapes such as circular or linear. In conclusion, SHINKAWA UTC 1000 is a reliable and high-precision surface mount bonder that offers superior accuracy and throughput for automotive, aerospace, and electronics applications. Its advanced design and features make it ideal for a wide range of surface mount bonding and soldering operations.