Used SHINKAWA UTC-1000 #9238871 for sale

SHINKAWA UTC-1000 is an advanced, high-performance bonder designed to support the needs of industries such as semiconductor packaging, solar cell panel production, power device assembly, and automotive electronics. The bonder has a modular design, allowing users to upgrade and customize the machine as needed for specific applications. The bonder utilizes a variety of power sources, including high-voltage and direct current power supplies, to provide precise and repeatable bond results. The flexibility of the bonder allows for a wide range of bonding properties, from high-reliability interconnects to extremely small plastic packages. SHINKAWA UTC1000 has a maximum bonding speed of 7200 bonds per hour (consistent in both X and Y directions). The machine is capable of controlling the rate of bond formation to 0.01mS, with stable and repeatable results. This makes it ideal for applications such as high-volume production of plastic packages, where precision bonding and accurate joining of small components are critical. In addition, a range of optional modules can add flexibility to the bonder, such as a temperature monitor and an advanced image processing system. The bonder also features a sophisticated Control System, allowing users to easily access functions and features. The system provides easy real-time monitoring and control of important parameters such as current, voltage, temperature, and force, allowing users to fine-tune the properties of each bond. It can also save and recall teaching programs for fast and easy recall. UTC 1000 is highly reliable and suitable for harsh production environments thanks to its motion unit which is protected against dust, dirt, humidity and shock. The machine also incorporates a high-speed X-Y conveyor with a maximum speed of 3840 mm/sec. The high-precision, multi-function positioners are held to an accuracy of ±1 µm. SHINKAWA UTC 1000 is a powerful and reliable bonder, delivering precision and repeatable results for high-volume production environments. It is ideal for a variety of applications, including solar cell panel production, power device assembly, automotive electronics, and semiconductor packaging.