Used SHINKAWA UTC-1000 #9257431 for sale

SHINKAWA UTC-1000
Manufacturer
SHINKAWA
Model
UTC-1000
ID: 9257431
Vintage: 2003
Wire bonder 2003 vintage.
SHINKAWA UTC-1000 is a fully automated industrial wire bonder. It is used to create durable and reliable electrical connection between a chip and a device or substrate. It is capable of automatic wire bond looping, rubber banding and gold ball bonding. This device uses the simple and proven technology of ultrasonic wire bonding to accurately and quickly create electrical connections between two parts. SHINKAWA UTC1000 consists of a vacuum-sealed chamber that houses the wire-bonding head and a robotic arm which is used to move the wire-bonding head to its desired locations. The head is capable of performing multiple types of bonding including ball, wedge, and ribbon bonding. It features a built-in optical microscope and is capable of analyzing and controlling the position of the wire during the bonding process. UTC 1000 is extremely efficient in its wire bonding process and is capable of precisely controlling the bonding parameters during the wire bonding process. It is very simple to operate as it has a user-friendly interface. The machine also uses a roller-roller mechanism for wire positioning. SHINKAWA UTC 1000 is able to manage the speed and power of the wire bonding process with a resolution down to 1 microsecond. This ensures the accuracy of the bonding process and helps to reduce wire damage. The machine is capable of manufacturing wire bonds which meet both IPC and MIL-STD specifications. UTC1000 also features a power saving mode which helps to reduce the total electricity consumed by the machine during operation. It has a working area of19" x 15" and can handle substrates up to 8" in size. This machine has a rated bonding accuracy of 0.0002". Overall, UTC-1000 is a reliable industrial wire bonder which is capable of producing consistent and reliable electrical connections between components. It features a user-friendly interface, advanced wire positioning capabilities, and precise control of the wire bonding process. It also has a power-saving mode which helps to reduce the amount of electricity consumed during operation.
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