Used TDK AFM 15 #293627854 for sale

TDK AFM 15 is a fully automated three-dimensional (3D) flip chipbonder. It is an advanced flip chipbonder based on the tried and tested principles of fine pitch flip chipbonding. This technology is designed to increase the accuracy of automated flip chipbonding and produce higher yield rates with significantly less chip damage. TDK AFM-15 is a high-precision flip chipbonder, which is capable of bonding sizes as small as 0.3mm pitch and down to 0.1mm pitch. It provides excellent bonding performance in tight pitches with both TA bump and Non-TA bump pad array sizes. AFM 15 is designed to reliably bond with a wide range of materials, including oxide and oxide-free substrates, copper, and aluminum. Its robust design ensures that the most delicate bumps are not damaged during bonding. Its advanced vision equipment, combined with ultra-precise motion control technology and reliable alignment accuracy, provide unparalleled performance in the industry. The CCD camera is capable of capturing 1000 frames per second for reliable imaging accuracy, and detects and inspects bumps, which are 100 microns or smaller in size. AFM-15 is also equipped with a mechanical three-axis alignment system, providing faster, more consistent and accurate chip-to-substrate alignment. This alignment unit works in combination with the vision machine to ensure repeatable, high-yield chip injection accuracy (CJ). Finally, TDK AFM 15 is also equipped with a high-performance, high-precision thermal tool. The asset consists of a hot plate, laser deposition heating technology, and a thermal plate. It accurately controls the temperature of each bump and area, while minimizing heat generation. This allows for high-yield bonding of device sizes as small as 0.3 mm or smaller, even in a large process window. TDK AFM-15 is an advanced bonding solution designed to meet the most demanding requirements of the flip chipbonding industry. Its robust design, accurate performance, and repeatable accuracy make it an excellent choice for achieving consistent, high-yield chip bonding on a wide range of materials.