Used TDK AFM 15 for sale
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Popular Product
TDK
AFM 15
Flip chip bonders, 8"-12" Chip size range: 300um ~ 5000um Bonding process: Gold-to-gold interconnec
103
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
70
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
55
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
75
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
48
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
99
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Does not include computer Power supply: Voltage: 200 V Frequency: 50
52
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
81
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: 200 V, 3 Phase, 50/60 Hz, 3 Amp
49
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
53
