Used TDK AFM 15 for sale
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Popular Product
TDK
AFM 15
Flip chip bonders, 8"-12" Chip size range: 300um ~ 5000um Bonding process: Gold-to-gold interconnec
161
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
132
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
119
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
133
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
101
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
156
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Does not include computer Power supply: Voltage: 200 V Frequency: 50
98
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
132
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: 200 V, 3 Phase, 50/60 Hz, 3 Amp
97
Popular Product
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
104
