Used TDK AFM 15 #293654144 for sale

Manufacturer
TDK
Model
AFM 15
ID: 293654144
Flip chip bonder Type: 1505D.
TDK AFM 15 is a state-of-the-art bonder specifically designed to offer a wide range of highly precise and efficient bonding solutions to industrial, scientific, military and other hi-tech applications worldwide. TDK AFM-15 bonder outputs non-contact, non-destructive, internal and external bonds with a precision previously possible only with manual bonding systems. It features an intuitive touchscreen with a fast and reliable controller enabling remote operation. The bonder is equipped with a 12-axis motion equipment, which allows for multiple wafer movement and rotation in a controlled environment, providing the ultimate in precision and accuracy for the final bond. The precision can be further enhanced, when desired, with the use of an optional intelligent, zoom-in microscope system. The microscope not only provides accurate inspection of the bonding areas but also outperforms manual operations using manual microscopes. AFM 15 has an integrated state of the art ion implant unit which provides improved surface planarity and reduces stress in the final bond, even between materials of different coefficients of thermal expansion. The bonder is also equipped with a precision flow measurement machine which enables accurate and repeatable accuracy with both liquid and gaseous sources of material. This helps to reduce waste and operation time and yields a higher quality and more reliable bond. The machine is user- friendly and cost-effective, and is ideal for industries such as semicon, medical, optoelectronics, and military. AFM-15 has a modest frame size and is compatible with existing manufacturing and handling equipment. The ease-of-use and accuracy provided by TDK AFM 15, along with the ability to bond materials of varying sizes, materials, and surface geometry make it a remarkable bonder. Its performance, accuracy, and efficiency have made it a favorite for a variety of industrial and medical applications.
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