Used TDK AFM 15 #9178422 for sale

TDK AFM 15 bonding machine is a state-of-the-art heated die bonder designed for quick and accurate assembly of flip-chip, leaded and non-leaded devices and interconnections. This unit provides the highest performance and quality in automated and manual assembly with complex packages and small die sizes. The bonded components are firmly held and integrated with the die attach process by its 15-axis motion equipment. The motion system is composed of three linear, three angular and nine rotational axes. This motion unit can manipulate the components with precision and accuracy in three-dimensional space. It offers a resolution of 0.5 microns, enabling bonding of both large and small components to tight tolerance requirements. TDK AFM-15 performs a wide range of applications, from simple die attach to the most complex 3D bonding processes. It comes with an integrated vision machine that is able to detect micro-structures or patterns on the die before the bond assembly process. This tool can also monitor the bond integrity and detect faults while in operation. Its high-resolution camera is also capable of detecting various defects in the packages. AFM 15 can process components as small as 0.5 mm and with a maximum height of 20 mm. It can handle die sizes as small as 20µm, giving users the ability to assemble and bond very small and intricate components with fast and reliable results. The maximum process speed is 30ips, so that high-volume and short-cycletime applications are achievable. AFM-15 is fitted with a three-heat range of programmable heater stages, enabling the use of a wide range of die attach materials. Heating stages are individually adjustable from ambient to 650°C, with peak temperatures up to 950°C. This flexibility enforces reliable die attach and avoids the risk of over- or under-heating. The process parameters within the machine are user definable and the machine is fully integrated with an industrial PC. The data associated with each application are saved and available for traceability and quality assurance purposes. It is capable of dealing with multiple components on a single wafer, higher speed yield and minimised re-work, thus increasing its cost effectiveness. This TDK bonder is equipped with a secure robotic arm and operates on a single platform. Users can change from one application to another in a fast and easy way, making it the ideal bonder for the most complex tasks. The device offers high accuracy and cost-efficiency, making it ideal for high-volume and short-cycletime production lines.