Used TDK AFM 15 #9237821 for sale

TDK AFM 15 is a high precision bonder designed to provide an accurate, repeatable production process. The bonder is an Automatic Fine-Motion (AFM) solution for bonding processes in the electronics industry. TDK AFM-15 is a programmable bonder that offers maximum accuracy and control over the bond process. It is equipped with two electrically activated XY-drives and an independent Z-axis, along with a programmable vision system that can inspect the bond sites. The bonder has a robust frame design with a large bonding window, allowing for large area bonding at high speeds. It is designed to support a variety of applications, including the production of integrated circuits, MEMS, sensors, RF and optical components, and Printed Circuit Boards (PCBs). The bonder is housed in a highly ergonomic enclosure and features an intuitive user interface. The operator can easily enter parameters to control the speed, force, and other parameters that govern the bond process. AFM 15 supports a variety of bonding heads, including wedge, coil, thermal, ultrasonic, and hybrid heads, allowing for a wide range of bonding options. The bonder is built for precision and consistency. To achieve this, the bonder has a built-in closed-loop, software-controlled feedback system that can adjust the force applied to the bond to maintain a high-quality bond. It also features an automated calibration system that can detect any variation in the bond area and automatically adjust the bond parameters as needed. AFM-15 is a reliable and repeatable bonder that delivers consistent performance day after day. It provides fast set-up and a short learning curve, making it an ideal choice for high-throughput and high-precision bonding applications. The bonder is also compatible with BondGuard, an optional software package that can provide advanced process monitoring and data analysis. This ensures that the bonder meets the highest standards and delivers optimal performance in the production environment.