Used TDK AFM 15 #9229912 for sale

Manufacturer
TDK
Model
AFM 15
ID: 9229912
Wafer Size: 8"
Vintage: 2017
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 30 Amps 2017 vintage.
TDK AFM 15 is an automated, micro-assembly bonder specifically designed to provide cost-effective, high-precision manufacturing solutions for multiple microelectronic device types. The unit offers accuracy, reliability and repeatability over a long service life, producing quality components for a variety of industries. The Infrared chip bonding machine consists of two modules: a bond module and an inspection module. The bond module features a chip placement stage, a programmable chip-to-chip distance adjustment equipment, alignment tools, and programmable speed control. The chip placement stage uses an adjustable bonding head and a precision x-y-t-control system to precisely control the position and speed of the chip during the placement process. The inspection module provides automated visual inspection functions for component inspections before, during, and after the assembly process. This ensures reliable and consistent production of quality components. Furthermore, both modules are equipped with high-resolution cameras, enabling users to determine the positioning accuracy of components being placed in chips. TDK AFM-15 is an automated, easy-to-use unit. The user-friendly PLC Control Machine (PCS) offers a highly intuitive human-machine interface to provide added convenience. It is also equipped with simple, high-precision control mechanisms to ensure quick and reliable chip-to-chip placement of components. Additionally, the high-speed motion control tool and advanced alignment sensors provide precise chip positioning and component alignment. AFM 15 is made from superior materials and features a superior heat dissipation asset for increased operational efficiency and accuracy. Additionally, the unit is designed in conformity with ISO 9001 and ISO 14001 standards for quality and environmental control, ensuring environmental compliance. The bonder also offers user-friendly maintenance and supervision features, including automated fault logging and reporting for quick diagnosis and maintenance. AFM-15 offers customers outstanding precision, reliability, and repeatability, resulting in superior product quality. By providing a leading-edge micro-assembly solution, users benefit both from higher outputs and cost savings, making it a perfect choice for high-precision manufacturing applications.
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