Used TDK AFM 15 #9083098 for sale
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ID: 9083098
Flip chip packing system, 5", 6", 8" & 12"
Mounting tact time: 0.75sec / chip
Mounting precision: ± 7μm / 3σ
Footprint: 0.99 m2
12" wafer capacity of:
Chip (Chip): MAX: 2.5W × 2.5D × 1.0Tmm
MIN: 0.3W × 0.3D × 0.1Tmm
(Option: Max 7.0W × 7.0Dmm)
Substrate (substrate): MAX: 180W × 120D × 3.0Tmm
MIN: 50W × 50D × 0.3Tmm
(Option: MAX 8 inch Wafer)
Mounting tact Time (installation cycle time): 0.8sec / chip
(Including 0.2sec process time)
Accuracy (accuracy): ± 7μm / 3σ
MAX Load (maximum load): 25N (option: 50N, 100N)
Chip Supply (chip supply): 5,6,8.12inch wafer etc.
Wafer magazine auto loading
Standard Features:
Pre-heating units
Bonds heater table
Automatic nozzle cleaning
Ultrasonography
Bump height measurement collapse
Bump-free detection
Bad mark detection
Wafer Sita axis correction
Wafer expansion
Hot blow
Monitoring the nozzle surface
Local area network
Nozzle engagement counter
Production management data
Option and Special Features:
Magazine loading / unloading
High-efficiency air filter
Static eliminator
Profile Monitor (USA, load, bump height)
Chip Tray Supply
Map data (irregularities between the bonding machine, etc.)
Bonds nozzle heater
Substrate (package) special fixtures
Bond test (pre, post)
Bonds nozzle polishing jig
Ultrasonic horn (for large chip.
TDK AFM 15 is a fully automatic contact bonder designed for semi-automated, high volume product assembly. It is engineered for precision and consistency, achieving high levels of reliability and accuracy in a compact footprint. The equipment is capable of producing wire-bonds, aluminum tab bonds,coupled bonds, board-to-board, and other board-based assembly processes. TDK AFM-15 is a plug-and-play equipment that is hosted on a 3-axis XY-table motion system. The bonder features a precision bond head, capable of z-axis placement accuracies of 10 microns. The unit offers a wide range of bonding functions including solder, epoxy, and laser, as well as a variety of wire sizes, materials, and wire polarities including round, flat, and dicing. AFM 15 has a fully computer-controlled machine with an extensive library of settings that allow preprogrammed recipes for repeatable high-volume production. In addition to automated tool setup and device matching, AFM-15 provides a full range of programmable features for wire bonding, such as power level, ribbon size, wire speed, prognostication, thickness compensation, and surface finish. The asset accommodates either single or double wire bonding, with a wire-pen diameter range from 12 mil (approximately 0.3 mm) to 35 mil (about 0.9 mm). The bonder is compatible with various lead-free solder chemistries including TPE, Eutectic, and SnPb, as well as paste-like solder compounds. TDK AFM 15 is housed in a sealed aluminum and steel module, which is designed to minimize vibrations and other environmental disturbances. The power requirements are regulated by a built-in power supply, with an input voltage of 220-240 VAC 50/60 Hz. The device features self-diagnostics, ensuring a consistently reliable operation, and includes a safety model to help prevent accidental production errors. The equipment is compliant with RoHS, REACH, and WEEE standards.
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