Used TDK AFM 15 #9156895 for sale

Manufacturer
TDK
Model
AFM 15
ID: 9156895
Flip chip packing system.
TDK AFM 15 is a manual, thermal controllable, thermocompression bonder with high accuracy. It is designed for advanced packaging processes such as wirebonding, die making and hybrid component assembly. This versatile and robust bonder is perfect for research and development, medical device and component production applications. The bonder is suitable for a wide range of applications where precision and repeatable results are required. Its compact and economical design make it an ideal choice when space is limited. It is also designed to provide reliable and accurate bonding of delicate materials. The unique features of this bonder make it suitable for a broad range of materials such as semiconductors, Printed Circuit Boards (PCBs), Flexible Card Circuits (FCCs), and Polyimide Films (PVMs). The bonder is equipped with an integrated manual accretive thermal pressure control system, which provides reliable and precise temperature control. It also features a sophisticated thermal control system for precise thermal-compression bonding. TDK AFM-15 bonder includes an adjustable focus XYZ assembly stage, which provides precise alignment and accurate bonding control. It can also generate fast cycle times due to its X-Y stage speed of up to 250 mm/s. The bonder also features a variety of accessories and options such as chip adjuster, die clamp, card clamp and control box. To further improve accuracy, the bonder is equipped with an auto-compensation function that adjusts the position and pressure simultaneously to ensure accurate and repeatable results. The bonder is also equipped with an auto-feedback system that allows it to act as a stand-alone machine without any additional input. This feature makes it suitable for fully automated processes as well as continuous-feed production lines. AFM 15 is perfect for users who require precise bonding with high repeatability, fast cycle times and good thermal control. Its reliable and versatile components make it an ideal choice for a variety of production and research applications. Its compact size and economical design make it a great option for businesses with limited space.
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