Used TDK AFM 15 #9290808 for sale

TDK AFM 15 is a Manual Wire Bonder designed for use in semiconductor and printed circuit board (PCB) applications. This bonding equipment boasts an automated wire feeder that enables consistent wire feed and positioning control, enabling accurate and reliable bonding. TDK AFM-15 also features a high precision placement accuracy of up to ±15µm. AFM 15 comes equipped with a cantilever platform for accurate and easy placement of components. This platform is mounted on a three-dimensional motion-control stage, which allows for controlled feedback-based placement of the components. This stage is also capable of complete rotational movement, providing maximum flexibility for performing complex bonding operations. AFM-15 is configured with an optical vision system that enables automatic inspection of each bond. The unit is capable of recognizing component details, as well as detecting defective bonds with an accuracy of up to ±0.1µm. This feature also assists with positioning of the component on the platform, providing for even greater productivity. TDK AFM 15 is designed with a reliable and easy-to-use interface that can be operated with ease. It has an intuitive menu-driven control machine, which enables the operator to simply select the type of wire to be laid and the programmable parameter settings to be entered. The tool also comes with a built-in resolution display, allowing for monitoring of wire placement. TDK AFM-15 is powered by a low-noise, high-speed vibration dampening motor, allowing for smooth and stable operation. The motor is also capable of running at variable speeds, ensuring flexibility for the various types of jobs. Furthermore, integrated operator safeguards help to reduce risk of injury, should accidental contact with the bonder occur. AFM 15 is an efficient bonding solution that offers powerful automation capabilities. With its features and performance, it guarantees accurate and reliable manual wire bondings. Requiring minimal setup and maintenance, AFM-15 is an ideal choice for a wide variety of semiconductor and PCB applications.