Used TDK AFM 15 #9229914 for sale

Manufacturer
TDK
Model
AFM 15
ID: 9229914
Wafer Size: 8"
Vintage: 2017
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 30 Amps 2017 vintage.
TDK AFM 15 is a high-precision bonder used in the packaging, microelectronics, medical and solar industries. It is an automated machine that can be used for mass production of ultrasonic and thermal bonding applications. TDK AFM-15 is a programmable ultrasonic or thermal bonder that offers efficiency, repeatability and dependability when it comes to bonding structures. It has a modular design and an easy-to-use touchscreen controller that allows for quick and precise setup of processes. AFM 15 features multiple software-controlled and adjustable features, such as: pulse-energy and pressure monitoring, amplitude control, bond qualication, temperature and force control, and self-calibration functions. Various settings can be stored for quick job recall. It also offers redundancy in ultrasonic control for safety to ensure the integrity of the resulting bond. AFM-15 features a range of heater platens, from 200mm x 100.7mm to 500mm x 300mm, for optimized production throughput. It has an accuracy of ±0.05mm and a positional repeatability of ±0.03mm. It is designed to produce perfect, reliable ultrasonic and thermal bonds. This bonder has superior optics for precise alignment and inspection capabilities. Working distance and focusing lenses are adjustable, and cameras for blue light inspection are also available. The machine is outfitted with a gridlight cover that helps to ensure uniform light conditions. Stacked images allow the user to view the whole field of view so that no part of the assembly is missed. TDK AFM 15 offers top-of-the-line bonding technology for maximum production throughput and cost-effectiveness. It is compatible with many other tools and systems, and it is designed to integrate with existing production lines. It is backed by TDK superior customer service and support, making it a dependable and reliable choice for automated bonding applications.
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