Used TDK AFM 15 #9229935 for sale

TDK AFM 15 is a high-performance, low-temperature, thermo-compression bonding station for bonding die, die attach, flip chip assembly, chip on chip, and wire bonding. TDK AFM-15 features a unique four-bed alignment equipment that is ideal for thermo-compression bonding processes, allowing for precise die placement and fast bonding speeds. The station also features a patented hot planar heater, which ensures reliable and consistent heating of even the most intricate components. AFM 15 is one of the most versatile thermo-compression bonders available. It is capable of handling a variety of substrates, including silicon, alumina, ceramic, protective coatings, and metallic films. The patented heat flow control technology enables the bonding of components up to 1.2mm thick. Additionally, AFM-15 can bond components at temperatures ranging from 130° to 250°C. TDK AFM 15 offers a wide range of features to meet the needs of a variety of applications. The automated WLC (wireless local control) station allows users to quickly and easily configure the bonder and gain real-time diagnostics. Additionally, the station is equipped with a high-resolution vision system to ensure accurate and precise placement of the components. The station also allows for adjusting the bond force, welding pressure, and the duration of the bonding cycle. TDK AFM-15 is also highly resilient and durable. It is built to handle high temperatures and extended use. The automated WLC station is also dustproof, enabling the bonder to be used in cleanroom environments. Overall, AFM 15 is an impressive bonder with an unparalleled level of versatility. With its patented hot planar heater, automated WLC station, unique alignment unit, and high-resolution vision machine, AFM-15 is an ideal choice for any thermo-compression bonding process.