Used TDK AFM 15 #9229899 for sale

Manufacturer
TDK
Model
AFM 15
ID: 9229899
Wafer Size: 8"
Vintage: 2017
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 30 Amps 2017 vintage.
TDK-Lambda America TDK AFM 15 is a thermodebonder designed specifically for wire-to-board connections. This bonding tool provides high-speed looping and cutting operations for wire-to-board connections. The tool's speed and accuracy are unmatched by competing products. The sturdy cast aluminum frame and reliable components make this an ideal choice for manufacturing environments. TDK AFM-15 thermodebonder features patented "Hot Point Positioning" which uses the coordinate angles of the bonder to accurately position the bonder for better precision and smoother handling. The wire is fed securely and accurately along a groove in the frame which prevents slippage and increases tool life. An integrated cutting operation allows the tool to trim the wire loop after formation, eliminating the need for a separate cutting device. AFM 15 is capable of producing a variety of wire-board bond configurations, from 0.15 to 1.27 mm diameter wire. The tool head includes specialized tools that enable the user to create cylindrical, rectangular, and tongue and groove connections. An adjustable temperature control system helps the user configure the thermodebonder to produce bonds of varying strength. TDK-Lambda AFM-15 is designed with several safety features to protect users and maintain stable performance. An anti-shock system obscures vibrations and sudden movements, helping to reduce errors during operation. Overheating and short-circuiting protection guards ensure optimum performance and safety during use. In addition, the tool features emergency release buttons that instantly disconnect the wire during an unexpected malfunction. TDK AFM 15 thermodebonder is designed to be used in demanding manufacturing applications, offering exceptional speed and accuracy at a low cost. This durable and useful tool provides flexibility and produces high-quality, reliable wire-to-board bonds.
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