Used TDK AFM 15 #9364563 for sale

TDK AFM 15 is a thermal-controlled thermo-compression bonding machine designed to join two surfaces together quickly and with precision. It uses a combination of heat and pressure to create a strong intermetallic bond created between the two surfaces which results in a strong and reliable joint. The machine is a floor-mounted equipment that is typically used with a variety of substrates to produce high-reliability electrical connections. Its primary application is to bond small circuit components, such as chip packages, but it is also used in a variety of other electronic assembly processes. TDK AFM-15 is designed to provide an efficient and precise bond with speed and accuracy to make high-volume production lines more efficient. It is composed of four modular units that can be changed independently depending on the job at hand. The main features of AFM 15 include: A large working area to accommodate large parts. Adjustable heating and cooling rates and pressure. Automatic thermal compensator to ensure consistent condition between each bond cycle. Easy-to-use Automated Bond Parameter Control (ABPC) for setting the correct parameters and monitoring the actual bond cycle. CCD monitor to visually check the condition of the bonded part. Advanced diagnostics system for easy troubleshooting. Automatic height adjustment of the upper and lower plates for repeatable and accurate placement of parts. Standard vision inspection unit with pre-programmed pass/fail criteria to ensure error-free bonding. Double closure machine providing additional safety during operation and during the operator's physical absence. AFM-15 is widely used in a range of industries, including consumer electronics, automotive, medical and LED lighting, where accuracy and speed are essential. It comes with four different force and temperature configurations, designed to offer the most accurate bond for any given application. Overall, TDK AFM 15 is an ideal choice for those looking for a reliable, accurate and cost-effective bonding solution. With its range of customization options, it can be adapted to suit specific bonding needs, ensuring a consistent and effective bond each and every time.