Used TDK AFM 15 #9229901 for sale

TDK AFM 15 is an automated bonding machine specifically designed for flip chip assembly. This equipment bridges short distances between two separate electronic components at high speed and accuracy in a continuous, uniform manner. It enables attachment for a wide range of substrates, with the capability to shape and adjust the bond line. The system includes a variety of features specifically tailored for reliable and accurate flip chip assembly. It is equipped with a precise positioning unit, surface mount technology (SMT) head, and a pre-process station to ensure a consistent quality of output. Additionally, TDK AFM-15 features a fully automated ultrafine-bonding-pressure-control machine to ensure the bond between the two components stays consistent. The flip chip assembly process starts with the dual-head SMT placement tool, which accurately positions and bonds the components. The SMT head features a 1.7 μm repeatability, enabling reliable, precise placement of the components. The force feedback asset ensures minimal contact force applied to the parts and prevents any damage to them. Before the bond is integrated, the components are tested for any short circuits and defects. This is all done in an automated manner and provides a quick inspection model to save time and money. AFM 15 can also inspect the bond line's condition and adjust it accordingly. The bonding head features a dual-end metering station which deposits and collects as much solder paste or flux as needed for the bond process. The nozzle equipment is adjusted to suit the application being used, while the pressure from the bonding head is set to maintain a good bond line. The heads are also designed to prevent any breakage to the components, while ensuring a high and uniform quality of bond. Finally, the system is equipped with a flip module. This feature automatically flips the components at the right moment, so that the components can be interconnected. The unit is equipped with a visual feedback camera, an LCD display, and a user-friendly operation software, making it an easy to use and reliable bonding machine. AFM-15 is an efficient bonding machine for reliable and accurate flip chip assembly. With its robust and accurate features, the machine ensures high-quality bonding with minimal effort at high speeds and precision.