Used TDK AFM 15 #9229900 for sale

TDK AFM 15 is a precise and reliable automatic flip-chip bonder designed for handling flip chips, thin-film components, devices, and leadframes. This versatile and affordable bonder features a wide variety of tool configurations and functions. Flip chip bonding is performed using an ultrasonic bonding process, while thin-film and leadframe bonding utilizes a thermocompression or thermomigration method. The high-precision bonder features an XY motion platform and an angular tilt range of up to 50° off centerline. It has integrated cameras for both alignment and defect inspection, enabling a visual verification of the placement accuracy. TDK AFM-15 can also be equipped with several tool options, allowing for different application and bonding requirements, including advanced dispense, bonding, and die attach tools. AFM 15 bonder offers flexible tool configurations and capabilities, including a die bonder, a gold bump bonder, a wire bonder, a wafer-bonder, and a frame bonder. All these functions are easily accessed through a high-resolution touchscreen. The system is fully integrated with integrated vision systems to ensure accurate placement and inspection. The high-speed flip-chip bonder also features a built-in oven to provide preheating for the circuit substrate. This feature further ensures the integrity of the board and the bond. The board is maintained in a streamlined position to ensure that the IC placement is as precise as possible. AFM-15 is a fully automated bonder that quickly and efficiently processes multiple substrates with a single automated process. The system is designed to be easily integrated into production processing lines and offers up to 400 WPM throughput capacity. With this bonder, production lines can meet the latest high-volume demands for high-precision die attach and wire bonding.