Used TDK AFM 15 #9229910 for sale

TDK AFM 15 is a desktop bonder which provides high-precision microassembly for industrial and research applications. TDK AFM-15 is capable of handling various materials ranging from metal, polymer, glass, and ceramic assemblies. AFM 15 is a robust bonder featuring a user-friendly adjustable vacuum holder and a motion equipment with a 1.5 mm Z-Axis travel and a rigid 3-Axis stage with a resolution of 100 µm. The flexible bonder features integrated viewing optics with a zoom lens for easy magnification and an air nozzle for wicking and dispensing. AFM-15 can handle a wide range of substrates and substrates packages from 0.15 mm up to 10 mm and has a 0.15 mm pitch accuracy. The bonder is also equipped with three bond heads for various array bonding in addition to wire bonding and manual flip-chip assemblies. TDK AFM 15 features an automated thermal control system with a continuous temperature monitor and up to three programmable, heated, and cooled heads that can be set to a specified precision. Additional features such as one integrated expandable vision unit with a 4 Megapixel CCD camera and LED control, a vacuum filter machine, and rigid frame construction ensure the accuracy and reliability of the microassembly process. The unit is also housed in a robust and compact construction to provide maximum portability and ease of use. TDK AFM-15 is the ideal bonder for industrial and research applications due to its robust construction and precise bonding performance. The three bond heads maximize the flexibility of the tool and the automated temperature control provides accurate and precise temperature control to ensure the best bonding results. The integrated vision asset and rigid frame construction guarantee the highest performance and accuracy for microassembly tasks.