Used TDK AFM 15 #9198782 for sale

TDK AFM 15 is a high end die attach bonder that is an excellent choice for precision and high quality work. This bonder is ideal for applications that require precise placement of small components and for applications such as flip chip, mixed technology or ball grid array assemblies where there is a need for absolute accuracy while attaching the component. The unit has a footprint of only 10" x 10", and features an XY Die head with adjustable heaters, a vacuum pickup with vision equipment, and a robustly designed stage that allows for easy placement with either manual or automated operation. The unit also features an on-board vacuum wait-state delay and adjustable bond head power to help ensure accuracy during the placement process. The USB interface also gives it increased compatibility options, while its extended window allows for viewing of both the component and substrate. TDK AFM-15 is capable of achieving ultra-precise results, with an extremely fine pitch accuracy of 0.0025mm. For even greater accuracy, the unit can be operated in manual mode, with the added ability to adjust the stage disperses. This bonder features a precision linear stepper motor, allowing for accurate placement of components during the bonding process. The unit also comes with a built-in surface mount placement echo-checker, which allows for the automated corrections of linear and angular alignment, as well as the verification of bond quality. AFM 15 has a long list of features that make it a great choice for a wide variety of applications. The bonder is equipped with a variety of Digital IO ports, allowing for accurate and repeatable results regardless of part geometry complexity. This includes a scanning system with an extended field of view window, allowing for the easy placement of components. The unit also has an internal video storage unit, allowing for the easy retrieval and analysis of previous bond data. Lastly, the unit is equipped with an automatic board positioning machine, allowing for quick and accurate positioning of the substrate in relation to the bonder head. Overall, AFM-15 is an excellent choice for anyone looking for a robust, reliable and accurate die attach bonder. The unit's extremely accurate placement tool coupled with its on-board video storage and extended view window make it an ideal choice for a wide variety of applications. With its long list of features and precision results, this bonder is sure to meet the needs of any engineer or manufacturing company.