Used BESI / ESEC 2100 HS #9228285 for sale
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ID: 9228285
Vintage: 2014
Die bonder
Strip handler 100 mm cold rail (SH2 100cR)
Magazine handler output (MHOUT)
Wafer handler, 12"
Pneumatic dispense system (PDS)
Vision system:
Dispense position (DVI)
Pick position (PVI)
Bond position (BVI)
Patented Phi-Y pick & place
Integrated safety package
User interface
Basic user management (BUSM)
Basic statistics (BSTAT)
Device reject mark check (DRMC)
Included accessories:
102423503 (2) Process insert 100 flexes
102423221 Vacuum set foils 100 (5x20, var colors)
102423547 Punching tool for flex inserts
102277710 Syringe adapter 10 ml
102381831 Syringe holder mini cap 10 ml
102381947 Holder mini cap
102381941 Mini cap di=0.4 mm
102325189 Die ejector set A with chuck 90G
102223273 Die ejector needle setting tool
1000-6877 Pick up shank type B
250.0055.0 Rubber tip 80 mils
240.0070.1 Vacuum grease apiezon (1 x 25 g)
SH2_100cR Strip handler 100 mm cold rail
MHIN Magazine handler input hS
WMP Wafer mapping package
IILL Indirect illumination 125, dispense or bond position
HOST Host communication interface
IONC_P Ionizer-controlled pick
PELD Epoxy level detection
BQC Bond quality check
DQC Dispense quality check
PPDS Purge and pre-dispense station hS
102418836 Wafer ring unit WRU
102410219 Wafer ring adapter 8"
102420203 Lens PVI 22 x 22 B
102420204 Lens D/BVI 22 x 22 B
102277710 Syringe adapter 10 ml
102381831 Holder 10 ml
102381947 Holder mini cap
102381941 Capillary 0.4 TC
CSR 43210 Strip mapping option
102228676 Force calibration unit 50 N
102236994 Maintenance tool case
102236996 Service tool case
102223986 Calibration tool case
2014 vintage.
BESI / ESEC 2100 HS is a state-of-the-art die attacher used for attaching semiconductor dies to leadframes. It features a powerful integrated platform, with a high-speed pick-and-place head, a transport assembly, and a vision equipment for accurate placement of the die. The pick-and-place head is designed for high-speed and repeatable placement of the die onto the leadframe. It features a high-resolution camera for precision alignment of the die, a servo-driven Z-axis for precise positioning, and a vacuum nozzle for attaching the die to the leadframe. The pick-and-place head is also designed for the gently handling of the die to ensure that it is not damaged during placement. The transport assembly moves the dies and leadframes between the various components of the attacher. It features a direct-drive servo motor, which enables accurate and repeatable placement of the die and leadframe. The transport assembly is integrated with an inspection system to ensure that only properly aligned components are used in the attachment process. The vision unit is able to accurately monitor the alignment of the die and leadframe and detect any misalignment. It uses a high-resolution camera for accurate alignment and optical inspection of the die and leadframe. In addition, it uses a combination of image processing techniques to detect and correct any misalignment before placement. Finally, BESI 2100 HS is equipped with a programmable controller that allows the operator to customize the operation of the attacher. This enables the operator to select the best parameters for each job, such as the placement speed and accuracy. The controller also has a built-in log to allow the operator to track the die-attaching process and easily make necessary adjustments. Overall, ESEC 2100 HS is a reliable and powerful tool for the attachment of die to leadframes. It features a high-speed and accurate pick-and-place head, a transport assembly, and a vision machine for precise alignment and inspection of the die and leadframe. In addition, the programmable controller enables the operator to customize the operation for repeatability and accuracy. Together, these features make 2100 HS an ideal choice for efficient and dependable die-attaching operations.
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