Used CANON / NEC Bestem D10SP #9394673 for sale

CANON / NEC Bestem D10SP is an automatic die attaching machine that offers a high level of accuracy and precision for processing IC packaging. This machine uses a two-stage pick-and-place process to accurately attach individual dies to each IC package, ensuring a reliable connection without any stress or damage caused from the strain of manual processes. This machine is ideal for a wide variety of IC packages, such as FBGA, uBGA, PGA, QFP, chip scale, SOJ, and BGA, and can process up to 10,000 IC packages per hour. The machine requires minimal setup time and is designed with an automated IC tray loader and an IC package pick-and-place process. It has a built-in vision system that is capable of detecting and controlling each die's position accurately, ensuring precise placement of individual dies. It also has an adjustable die placing force to achieve the desired connection strength for each sample. NEC Bestem D10SP has a temperature-controlled oven that can reach temperatures up to 230 degrees Celsius, allowing for a controlled soldering process of the connecting terminals. It also has an automated die attach process for both wire and ribbon type connections, making it a versatile solution for a variety of IC packages. CANON BESTEM-D10SP has several other features that make it convenient and easy to use, such as automatic dies taping, advanced noise and vibration isolation, and multiple interfaces for convenient program backups and parameter changes. Additionally, the machine has a low-maintenance design with few moving parts that need regular maintenance. Overall, Bestem D10SP is a reliable and flexible die attaching machine that is perfect for any IC packaging process. Its automated two-stage pick-and-place process offers the highest level of precision and accuracy, while its multiple features make it a powerful and versatile solution for any IC package.