Used DATACON / BESI 2200 APM #293586736 for sale

DATACON / BESI 2200 APM is a high-performing, automated die attacher designed for die bonders for use in the semiconductor industry. The machine is designed for high-speed, precision die attachment and comes equipped with a range of innovative features, including a vision equipment, integrated assembly platform and a robotic arm with a tool changer. The vision system at the heart of BESI 2200 APM utilizes a high-resolution camera with an automated focus and an integrated log analysis unit. This machine is integrated with a library of automated algorithms, which enables it to recognize the die and correctly identify the targeted die attachment positions. The vision tool is also capable of carrying out inspection tasks such as presence/absence recognition and measuring the height and diameter of the die. The integrated assembly station is designed for the automatic placement of die onto the substrate. Utilizing an integrated vacuum chuck, the assembly station is capable of accurate placement of the die to the substrates, with a highly repeatable accuracy. This ensures consistent performance, even when placing the same die onto different substrates. The robotic arm is the workhorse of the tool, in charge of transporting and positioning the die as it is placed onto the substrate. With a tool changer, integrated into the robot arm, it is capable of quickly swapping between tools such as needles, grippers and other tooling accessories. The robot arm with tool changer allows DATACON 2200 APM to rapidly transfer and position the die for correct placement. Additionally, 2200 APM comes with a state-of-the-art software and control asset. This model is designed to allow for easy programming and setup of the die placement and inspection tasks. Furthermore, the software is capable of monitoring the equipment for correct functioning and provides detailed logging for troubleshooting and diagnostics. DATACON / BESI 2200 APM is the perfect choice for organizations in need of a reliable, high-performance solution for die placement and inspection tasks. Its automated systems and integrated vision ensure maximum performance and accuracy, while the software enables easy setup and monitoring of the system. With its range of innovative features, BESI 2200 APM is an outstanding choice for die bonders and semiconductor production professionals.