Used DATACON / BESI 2200 APM #293608884 for sale

DATACON / BESI 2200 APM (Automatic Placement Machine) is used for placing components such as BALL Grid Array or BGA, Flip Chip and Die on substrates. This is an automated machine designed to offer precision, speed and reliability during the process of placement. The use of BESI 2200 APM results in a minimum defects rate while helping to improve throughput, enabling faster time to market. It is used both in professional and academic production lines. DATACON 2200 APM is known for it's accuracy, with a die placement accuracy of +/- 10um. This results in minimized bonding force, reduced flip-chip die height variance and higher accuracy in joining operations. 2200 APM offers a wide variety of options, such as an integrated laser alignment system and advanced vision-based placement. Further, users can customize their process with a modular design, enabling an easy and cost-effective way to upgrade the system as product complexity increases. The modular design also helps to simplify integration of the system into existing production lines and processes. DATACON / BESI 2200 APM can be configured with a fully automatic setup, or with a manual setup. The automated mode offers the user the opportunity to manage placement parameters online and store placement programs. This helps to improve production planning and throughput and reduce setup time. BESI 2200 APM also has a number of user-friendly features, including intuitive display panels, auto-recognition of tools and a wide range of advanced process control options. This allows the user to tailor the placement process to the specific product being produced. In summary, DATACON 2200 APM is an automated die-attacher for placing BGA, Flip Chip and Die on substrates with a minimum defects rate. It is highly accurate, offers a modular design and user-friendly features. This ensures maximum efficiency, cost-effectiveness and reliability during the placement process.