Used DATACON / BESI 2200 APM+ #293616197 for sale

DATACON / BESI 2200 APM+ is a high-speed die attacher designed for full- or partial-mesh die bonding applications. It is capable of attaching components to a substrate at speeds up to 5100 die per hour (dpH). This high-performance machine also offers a high-precision alignment system and a broad range of feeder speeds. The die attacher is equipped with a re-assurably accurate vision system to identify parts and reposition them with a precision of +/- 15 microns. With its high accuracy, repeatability, and reliability, it guarantees the quality of connected components. BESI 2200 APM+ is also highly versatile, offering several options for processing tasks. In addition to machine-specific algorithms, it also supports user-defined algorithms for experiencing with processing parameters. Additionally, 3D vision is available for recognizing parts. It is an ideal option for applications that require a large number of pick & place operations, such as advanced packages for wafer-level, singulated, mid dies, and CSPs. Moreover, DATACON 2200 APM+ offers excellent process control through flexible die attach and advanced harnessing modes, providing the ability to adjust flux, die, and substrate temperature settings, as well as pressure and dispense parameters. This allows users to achieve exact desired results with relative ease. The machine also boasts advanced I/O capabilities, with motor control up to 24 Axes being available. In addition, this die attacher supports advanced networking capabilities with Ethernet and USB connections. With these connections, users can access their data remotely and monitor their processes from anywhere in the world. All in all, 2200 APM+ is an excellent choice for die bonding applications requiring high speed, accuracy, and versatility. It provides superior performance, expandability, and cost-effectiveness for a wide range of production and research projects.