Used DATACON / BESI 2200 APM #293626292 for sale

DATACON / BESI 2200 APM is an advanced die attacher designed for precision in the attaching of circuits or chips to substrates. BESI 2200 APM is a top-of-the-line automated die bonder capable of a wide range of functions such as pick-and-place die attach, wire bonding, flip chip and bumped die attach, and laser via fill. The computer-controlled equipment has a very robust construction and a generous working space, and it is capable of attaching parts up to10mm per side with a precision of 20µm. The device uses a custom-designed motorized Z-Axis to ensure maximum accuracy in the placing of products. Additionally, DATACON 2200 APM has a conveyor system with a settable speed so that work pieces can be transported to and from the die attach head. 2200 APM is equipped with an advanced optical magnification tool that a user can employ to inspect the die attach processing. The device also incorporates a software suite that can be used to track the position of the die and an automated diagnostics unit that allows for quick and easy troubleshooting in the field. For test and burn-in, DATACON / BESI 2200 APM offers an array of test sockets that enable the user to perform tests on the attached die. Furthermore, the device can be combined with an additional test handler for fully automated applications. The software used with BESI 2200 APM is simple and intuitive, making it easy for operators to interface with the machine and program it to attach die at accuracies of the 20µm level. Setup time is also minimal, with automation tasks typically requiring just a few minutes to configure. The software also has the capability of remotely accessing the tool, allowing technicians and engineers to perform service and maintenance tasks during non-production hours. DATACON 2200 APM provides a reliable, high-precision method of attaching complex chip and circuit components to substrates. The device has been designed with the user's needs in mind, with an emphasis on ease-of-use and increased production throughput. With its combination of automated components, advanced optical inspection, and comprehensive software suite, it is an ideal die bonder for high-volume production environments.