Used DATACON / BESI 2200 APM+ #293646563 for sale

ID: 293646563
Wafer Size: 12
Vintage: 2005
Die bonder, 12" 2005 vintage.
DATACON / BESI 2200 APM+ is a fully automated die attach machine designed for precise, reliable bonding of a wide range of die sizes and types. BESI 2200 APM+ is equipped with a precision die mounting equipment and high throughput production capabilities, making it ideal for high-volume applications such as flip chip, wirebond, and solder. DATACON 2200 APM+ uses a pick-and-place gantry system to precisely move components between the loading and placement position. This unit allows for flexible tooling and pick-and-place patterns, giving it greater accuracy and faster cycle times. The machine can automatically align the die with the substrate and apply a precise amount of adhesive. The adhesive is dispensed through an integral dispenser and is accurately placed on the substrate and die using a motorized precision mechanism. The settings of the machine can be changed to meet the requirements of any die type or size. Additionally, the machine has the capability to apply either paste form or pre-dispensed dots of adhesive. 2200 APM+ offers a powerful vision machine, allowing for easily recognizable object orientation, misalignment correction, and quality assurance during the bonding process. The machine is also equipped with a placement error correction tool, which ensures accurate die placement, even if the die is misaligned. DATACON / BESI 2200 APM+ is highly reliable and has been designed to provide maximum uptime performance with minimal maintenance needed. It is easy to use and has intuitive HMI controls, which provide quick access to all functions. The machine is fully compatible with SEMI standards, providing superior quality and process control for all applications. BESI 2200 APM+ is an excellent choice for high-volume die attach operations, providing reliable, accurate results with reduced production costs. Its combination of speed and accuracy makes it ideal for many applications, including flip chip, wirebond, and solder. The intuitive HMI controls and automated features make the machine a pleasure to work with, while its hardened steel frame ensures maximum durability and longevity.
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