Used DATACON / BESI 2200 APM+ #293753320 for sale

BESI 2200 Advanced Package Manufacturing (APM+) is an equipment solution that brings automated die attachment and sorting to the surface mount assembly process. The APM+ offers a number of advantages to help increase productivity and reduce costs. The APM+ comes equipped with advanced features to ensure it works reliably in high-volume production environments. It is a fully automated equipment that is capable of attaching standard chip die, as well as bins, DVDs, and Smart Media chips, to a printed circuit board (PCB). It can also handle larger dies like Flip-Chip BGA, LCC, and PA die. The APM+ can use adhesive dots to attach die to PCBs, or it can use a vacuum pick-up system for more precise die placement. The vacuum pick-up unit is capable of packing and aligning die on a denser footprint, while also minimizing adhesive dispensing time. The APM+ also offers an advanced bin machine, allowing users to classify die into individual bins and identify them quickly. This helps to reduce assembly time and increase process efficiency. The APM+ has a vision recognition tool that can accurately detect the exact location of the die while it is being placed. This ensures the highest level of quality and precision possible when attaching die. Additionally, the APM+ offers fully automatic die sorting capabilities, allowing operators to rapidly organize their inventory and assign proper die to the PCB. This reduces time and labor, and also ensures that die is placed accurately. Overall, DATACON 2200 Advanced Package Manufacturing (APM+) is an incredibly reliable and advanced asset for attaching die to PCBs and for automatic die sorting. Its features greatly enhance the efficiency of the assembly process and can dramatically reduce production costs. With its fully automated features, high precision placement, and vision recognition model, the APM+ is an excellent choice for any production environment.