Used DATACON / BESI 2200 APM+ #293764668 for sale
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ID: 293764668
Vintage: 2004
Flip chip bonder
Image processor non-functional
2004 vintage.
BESI 2200 Advanced Placement Machine + (APM+) is an industry-leading die attach system used for fully-automated assembly of electronic components on printed circuit boards (PCB's). The APM+ provides superior repeatability and accuracy for the precision placement of large and small dies, making it ideal for high-volume assembly of chips, transistors, and other forms of electronic components. The APM+ utilizes advanced vision systems and robotics to precisely locate and attach dies on the PCB with high speed and accuracy. The vision systems are capable of recognizing multiple component types with magnification levels up to 400X, enabling exact placement of each die regardless of shape, size, and footprint. DATACON 2200 can also be linked to other inspection or testing systems for further quality control. DATACON / BESI 2200 offers a range of features that make it the ideal choice for any high-volume die attach project. The machine has a maximum speed of 6,000 parts per hour, enabling it to quickly and easily attach hundreds of components, even in the most complex designs. The APM+ is equipped with an array of interchangeable assembly tools for mounting components including flat parts, tubes and rods, ceramic components, and more. Additionally, it can handle a range of component substrates including kovar, copper, stainless steel, ceramic, and glass-epoxy boards. The APM+ is also known for its user-friendly design. The intuitive software interface allows for easy setup and programming of the machine, and the machine comes with a range of standard test fixtures to simplify the testing process. Additionally the machine can be customized to suit different applications with optional peripherals. DATACON / BESI 2200 APM+ is a reliable and versatile die attach machine designed to handle any die attach requirement. With its advanced vision systems and robotics, the APM+ is able to deliver high speed and accuracy for precision placement of components, making it an ideal choice for high-volume projects.
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