Used DATACON / BESI 2200 APM #9221032 for sale

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ID: 9221032
Vintage: 2001
Die bonder 2001 vintage.
DATACON / BESI 2200 APM (Advanced Pre-Forming Module) is a high-precision die attacher, designed by BESI for the manufacturing of electronic components. The machine works by automatically attaching dies, wire bonds and other components to printed circuit boards. It is a pneumatic equipment that helps to reduce the cost and complexity of electronic component manufacturing. The machine consists of a base unit, which houses the main components, and a number of modules that can be used for various tasks, such as pre-forming, die-bonding, wire-bonding, and eutectic bonding. The die-bonding module of BESI 2200 APM uses air pressure to attach the die to the substrate. Specialized contact fingers within the module hold the die in place while the air pressure is used to create and maintain contact between the die and the substrate. The die attacher is capable of attaching dies with an accuracy of up to 0.2 mils (5 microns). The machine also has a pressure control system that can be configured to provide a consistent bond. The pressure control unit ensures that the correct force is applied to the die during the attachment process, regardless of any variations in material properties or substrate dimensions. DATACON 2200 APM is highly configurable, allowing the user to choose from a range of processing options, including die-punching and wire-bonding. The machine can be used with different substrates, materials, and sizes, and is ideal for production runs involving multiple components. It is also easy to program, thanks to its intuitive touch screen interface. In addition to die-attaching, 2200 APM has other features which make it suitable for a variety of applications. These features include an integrated step-by-step instruction guide, integrated feeder modules for aligning and placing components, storage cabinets for spare dies, and a built-in error detection machine. Overall, DATACON / BESI 2200 APM is an innovative, user-friendly die-attaching machine that is designed to provide superior precision and accuracy for production runs involving multiple components. It is an ideal solution for manufacturers seeking cost-effective solutions for their electronic component production.
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