Used DATACON / BESI 2200 APM #9255558 for sale

DATACON / BESI 2200 APM is a die-attaching equipment that has been designed to perform assembly operations for integrated circuit (IC) packages and components. It is a highly automated system that can be used to attach individual die onto substrates and perform pick and place operations. BESI 2200 APM is composed of a die sorting unit, an adhesive dispense unit and a die picker unit. The die sorting unit is used to separate and align die before the pick and place process. The adhesive dispenser is used to apply a uniform and precise amount of adhesive to the die that needs to be attached. The die picker unit picks up the pre-sorted die from the die sorting unit with a vacuum nozzle and moves it to an exact location on the substrate for die attachment. The whole unit can be operated via a graphical user interface as it is integrated with PC-compatible control software. This control software allows the operator to easily set up process parameters and monitor the progress of the assembly. Moreover, it enables the operator to detect machine faults and initiate corrective action to ensure smooth and reliable operation of the tool. DATACON 2200 APM is equipped with an integrated vision asset which allows the operator to clearly monitor pick and place operations in real-time. It has also been integrated with a quality analysis feature that can test for possible defects in the die attachment process. This feature can detect die misalignment, incorrect die position, poor bond line, missing adhesive, and other imperfections in die attachment. The robust and reliable design of 2200 APM ensures efficient die attachment operations with minimal maintenance and downtime. Its high-precision nozzles provide accurate and repeatable die placement and its adhesive dispencing model ensures a uniform application of adhesive onto the die. This die-attachment equipment is designed to handle standard IC dies as well as unusual and complex shaped dies. Overall, DATACON / BESI 2200 APM is a versatile, reliable and highly automated die-attachment system that can be used to perform assembly operations for IC packages and components with flexible and precise operations.