Used DATACON / BESI 2200 APM #9258673 for sale

DATACON / BESI 2200 APM is a sophisticated and reliable die attach equipment used in a range of wafer level packaging applications. It is designed with a unique three-axis, high-speed motion control equipment that provides precise positioning of die in relation to the substrates. BESI 2200 APM offers accurate and repeatable die placement using a variety of alingment techniques, including automatic or manual, independent and programmable micro-positioning and alignment of dies to the substrates. The system also features a high-speed loop pattern recognition and laser alignment unit, enabling repeatable and precise placement every time. Additionally, DATACON 2200 APM can be programmed with multiple placement schemes and various speed settings for a variety of applications. 2200 APM is ideal for a range of low-volume and high-volume wafer-level packages including flip chips, micro bumps, and CSP's. It is equipped with three main components: an advanced CMCN (Controller Module Communication Network) machine, an imaging tool, and an integrated dispenser for adhesive applications. The CMCN asset is designed to streamline communications between the main computer and the motion control model and provides short-term and long-term optimization of the process. The imaging equipment uses three cameras to capture high-resolution images that are then used to accurately locate and position each device. The dispenser feature enables fast and accurate placement of adhesives onto the substrates, providing a high-quality and cost-effectively results. DATACON / BESI 2200 APM has a user friendly design and can be programmed using a comprehensive software package that is designed for easy setup and operation of the system. Additionally, the unit comes with a variety of different accessories including a mounting station, a cleaning tool, and a dust filter station, which enable efficient and cost-effective production. Overall, BESI 2200 APM is an ideal choice for a range of wafer level packaging applications. It is equipped with a range of features, ensuring precise and repeatable placement of die in relation to the substrates.