Used DATACON / BESI 2200 APM #9260184 for sale

DATACON / BESI 2200 APM is a die attacher system designed for higher speed performance packaged in a small, compact space. This device can attach large number of die to a substrate quickly, accurately and at a low cost with minimal operator intervention. It is compatible with multiple types of substrates and requires minimal set-up time. BESI 2200 APM uses a simple two step process to attach die to a substrate. First, it dispenses a precise amount of adhesive to the substrate that will hold the die in place. Then it uses a vacuum head to precisely pick up the die and attach it to the adhesive. This process eliminates the need for special compounders, air guns, and manual placement, decreasing the time and cost associated with die attachment. DATACON 2200 APM features a highly precise digital controller that controls the process from start to finish. This ensures each die is placed to within ±10µm tolerance and is orientated correctly on the substrate. The device also features an on-board camera which can inspect each die after it has been placed. This allows the operator to immediately identify and resolve any potential placement issues before continuing production. In addition, 2200 APM features an intuitive user interface that makes it easy to program and set-up the device for a variety of applications. It has a variety of mode settings which can be used to adjust the speed, accuracy and safety settings needed for each type of die attachment. The device also features an LED status indicator which alerts the operator to any problems that need attention. DATACON / BESI 2200 APM is a reliable and efficient die attacher system that can increase the yield, reduce costs and speed up production time for higher speed applications. It is designed for easy maintenance and with minimal post-attachment cleaning needed, helping to minimize downtime and maximize production yields. Overall, BESI 2200 APM is a great choice for those looking for a fast, cost-effective and precise way to attach die to substrates.