Used DATACON / BESI 2200 APM #9277552 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

ID: 9277552
Wafer Size: 12"
Vintage: 2001
Die bonder, 12" Single module Wafer bank: 10" (10.5" Opening on magazine) Camera Multiple wafer handler for wafer cassettes (6) Pickup tool changers (5) Pepper pot changers Epoxy dispenser: Time / Pressure No JEDEC tray Wafer magazine lift with pull arm for table Tool changer: 6-Slots Nozzle calibration tooling includes: Pressure plate for Z Camera for X and Y Eject tool carousel Scope Wafer lift Infeed / Outfeed belts Does not include: Microscope Microscope mount 2001 vintage.
DATACON / BESI 2200 APM is a die attacher specifically designed for attaching dies to a substrate. This equipment produces high interconnect yields and is an indispensable tool for high volume production. BESI 2200 APM utilizes advanced technology to ensure the attachment of dies with maximum reliability and repeatability. This die attacher is equipped with an automated Tool Positioner (ATP) with Vision Control. The ATP is pellicle based and can move in three axes in order to precisely align the die to the substrate. The ATP movement system is also incorporated with a Vision Control unit to provide precise placement and accurate repeatability of the die to substrate position. DATACON 2200 APM utilizes a laser-based die attach process, which uses a diode laser for precise positioning and an optics package to focus the laser energy onto the attachment section within the die. The laser energy from the diode laser is controlled by a digital controller, allowing consistent and precise die attachment results. The machine also incorporates a 6-axis force/torque transducer that provides feedback to the AT30-EPI die attach tool. This is used to determine the exact forces and torques applied at each attachment point and provides the operator with feedback of the successful application of temperature and laser energy for each attachment. 2200 APM is also equipped with an ITL-1 die handling module which is capable of automatically loading and unloading dies with up to 550mm2 die area. The ITL-1 also has a chamber integrity asset that continually monitors the closed loop function of the model. The AT30-EPI die attach equipment utilizes a dual process controller, one set to control the laser and the other to control the temperature of the die. This is to ensure that temperature is tightly controlled throughout the entire process and that the laser energy is used to its maximum benefit. DATACON / BESI 2200 APM is capable of handling dies with a profile of up to 28mm and widths up to 16mm, and can provide repeatability of up to four microns. The system is enclosed in a class 10K clean room and is equipped with a multiple safeguard unit to ensure that the environment is kept as constant as possible. BESI 2200 APM is an ideal solution for various productions and can provide high yields and reliable die attachment results. It is operator friendly and can handle all types of die constructions. The machine is designed to provide quick and seamless integration with existing die attachers and systems.
There are no reviews yet