Used DATACON / BESI 2200 APM #9302326 for sale

DATACON / BESI 2200 APM is a highly advanced state-of-the-art die attacher machine, used for attaching integrated circuit component dies to substrates. It is widely used for flip chip, flip die, and package assembly processes. BESI 2200 APM is designed for use in challenging production environments, providing critical process performance at high speed. The machine features maximum tooling flexibility and is compatible with various types of substrates and die devices. It can easily accommodate substrate sizes ranging up to 12" x 12" (305 x 305 mm) and features an advanced vision equipment for setting up mount components precisely and quickly. DATACON 2200 APM has been designed to provide a quiet and clean process environment. It utilizes a unique vision system and advanced software which allow it to accurately focus on die and substrate components. The machine packs a punch with a full range of powerful transfer arms, 3-axis bond head, linear gantry, and a wide range of high-precision placement and assembly capabilities. 2200 APM's advanced automation and self-programming systems make it capable of setups, start-up, maintenance, and troubleshooting without complex setup procedures. This allows operators to quickly complete their assigned tasks and move the unit to the next stage of the process. The machine also features built-in edge detection for accurate die alignment, a tweezer-based insertion machine to reduce substrate stress, and an innovative spike-free attachment technology. DATACON / BESI 2200 APM is equipped with efficient lights-out operation and extended uptime as well. It also offers from 1 to 4 arms and a high-precision placement accuracy of 0.2 μm, eliminating the need for manual adjustment of setup parameters. In conclusion, BESI 2200 APM is a powerful and versatile die attacher capable of consistently delivering quality results. It is an ideal solution for challenging production environments and ensures rapid and accurate die attachment.