Used DATACON / BESI 2200 APM #9364780 for sale

DATACON / BESI 2200 APM is a fully automated die attach machine designed for bonding a wide variety of components to printed circuit boards (PCBs). This machine uses a pick-and-place methodology to precisely place components on the board and can bond them with either an epoxy, an ultrasound, or a wave-soldering process. The machine's settings can be controlled without any programming knowledge, allowing for repeatable, consistent, and reliable results. The operator can configure the machine for the correct production speed for the application, with a maximum speed of 3,000 components per hour. BESI 2200 APM is also equipped with a vision system that can check components for correct placement. The machine is designed for a wide variety of components, including fine-pitch, chip components, axial and radial leaded parts, and power connectors. It is suitable for both manual and automatic loading/unloading of parts, and can handle components as small as 0201. The pick-and-place precision of DATACON 2200 APM is +/- 15 micrometers, allowing for precise placement of components on the board. The machine is also equipped with a high-power laser for attaching components with an epoxy or other adhesive. The laser is capable of providing heigh precision, with a bonding accuracy up to +/- 40 microns. It also has a fast heat-up and cool-down rate, with a maximum rate of 1,800 watts per second. Finally, 2200 APM is equipped with optional auto-align features, allowing for easy alignment of components. This eliminates the need for manual alignment and can result in significant time savings and higher accuracy rates. In summary, DATACON / BESI 2200 APM is an advanced die attach machine that offers a fast, precise, and reliable solution for bonding components to printed circuit boards. The machine is easy to configure, can bond a wide variety of components, and is equipped with a high-powered laser and optional auto-align features.