Used DATACON / BESI 2200 APM #9399839 for sale

DATACON / BESI 2200 APM die attacher is a tool used to pick-and-place components during the electronics manufacturing process. It is capable of quickly, accurately, and reliably attaching small and large components such as capacitors, resistors, and integrated circuits onto a board. It is an ideal solution for high-volume, high-speed assembly operations as it is capable of quickly picking and placing components onto a board at speeds of up to 5000 DPH (dots per hour). BESI 2200 APM features an advanced vision equipment and is equipped with a solder paste drop-down stand, which helps ensure the accurate placement of components onto the board. The vision system is capable of detecting misalignments between the component and the board that could lead to poor contact between the two, thus reducing the chances of shorts, opens, and other defects. The tooling used by DATACON 2200 APM is extremely accurate and reliable. The die attacher employs a high-precision auto-adjustment unit that ensures the tool tip is precisely adjusted for each operation. This machine helps to maintain accurate spacing and height between the die and the substrate, thus ensuring the desired results. 2200 APM also offers a wide range of customization options. It is equipped with various feeder tool attachment points and silos, allowing for the use of standard parts, as well as custom components. The tool also features a special alignment claw to increase reliability and accuracy. This allows for unsupported components or substrates of varying thicknesses to be attached with ease. DATACON / BESI 2200 APM can be easily integrated into existing workflows. It supports industry-standard communication protocols, such as Ethernet and USB, which allows it to communicate directly with other machines and equipment. It is also capable of running independently, without the need for constant manual intervention. Overall, BESI 2200 APM is a versatile, reliable, and accurate die attacher that can be easily integrated into existing electronics assembly processes. It is capable of quickly, efficiently, and reliably attaching a wide variety of components and substrates onto a board with precision and accuracy. Additionally, its advanced vision asset and customizable features make it an ideal solution for high-volume, high-speed assembly operations.