Used DATACON / BESI 2200 Evo Plus #293645951 for sale

DATACON / BESI 2200 Evo Plus die attacher offers state-of-the-art equipment for precise die attach applications. It is a fully automated equipment that is designed to ensure highly accurate and fast die attach results. The system boasts a die attach accuracy of 4μm, making it a precise and reliable choice for a variety of applications. The unit is composed of a self-loading magazine, an independently-moving X-Y-θ platform, a fast Z-axis, a rotary pick-up head and a hot gas machine. The magazine enables the consistent loading of a wide variety of device types and packages onto its X-Y-θ platform. The independently-moving platform then positions the components accurately and quickly, while the fast Z-axis ensures repeatable alignment of the bonding head over the contact points of the device. The rotary pick-up head provides refined die placement along with the ability to locate, pick-up and provide a precise placement of the die, allowing for a precise and accurate die attach process. The hot gas tool also enhances precision, by providing an adjustable heating profile to ensure an even temperature distribution across the device's contact points, as well as a stable atmospheric pressure for a higher bonding yield. BESI 2200 Evo Plus offers top-down and bottom-up die attach capability with its high-precision vision asset. It is capable of capturing images up to 20μm, facilitating highly accurate die placement. Combined with its ability to process a wide range of device types and packages, the model is suitable for a variety of demanding applications such as MCM, BGA, Chip Scale and Flip Chip die attach. To ensure reliable and repeatable results, DATACON 2200 Evo Plus is certified to ESD MIL-STD-2000 requirements and is compliant with other highly regulated standards in cleanroom environments. Designed with accuracy, reliability and ease of use in mind, 2200 Evo Plus is an ideal die attacher for a range of demanding application needs.