Used DATACON / BESI 2200 Evo Plus #293758188 for sale

DATACON / BESI 2200 Evo Plus is a high-speed die attacher made by ASM Assembly Systems. This device is designed to increase production efficiency and throughput and features a modular design and an innovative system for assembling leadframes. BESI 2200 Evo Plus consists of three modules, each designed for a specific function. The DoC module is the main module, controlling all the other modules and responsible for the die attach process. It features a pressure-sealing automatic vision system and a high-resolution process camera to ensure precise positioning of the die onto the leadframe. Additionally, the DoC module includes a vision-controlled die pick-and-place mechanism which can hold up to four components. The Edge Deskew module realigns leadframes that have become misaligned during the die attaching process. It also supports die sorting and placement of misaligned dies onto the leadframes. The Auto Pre-Heat module helps to ensure effective die bonding by pre-heating them prior to the die attaching process. The module is equipped with multiple protective mechanisms which, when activated, prevent the die from overheating and avoid damage to the device or the die. DATACON 2200 Evo Plus is designed to be fully integrated into any flexible or semi-automated system. It is capable of operating at speeds of up to 20 die per minute, and is available in multiple configurations including different tooling kits. In summary, 2200 Evo Plus is an efficient and reliable die attacher designed for the production of various electronic components. It features three modules, the DoC, Edge Deskew and Auto Pre-Heat modules, each designed to perform a specific function and increase throughput. This device is capable of operating at high speeds, and its robust construction and comprehensive protection mechanisms ensure its durability and reliability. ideal for manufacturers looking to optimize post-reflow die attach.