Used DATACON / BESI 2200 Evo Plus #293822140 for sale
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ID: 293822140
Vintage: 2023-2024
Die bonders
Dynamic XYZ
Theta servo motors
Machine capability: 7 μm @ 3s
Besi in-house pattern, fiducial recognition system
lighting systems with RGB
CMOS: camera, optic, illumination
Substrate handling with transporting system
Bond force sensor
Mini-BMC kit: 0.0045°
PC
Operating system: linux GUI
2023 vintage
Qty / Part / Description
Option:
(1) / DC2801MM / 2200 evo plus MASTER MODULE
(1) / DC000009 / Belt transport system C-type
(1) / DC1278 / Input buffer
(1) / DC1528 / Output buffer
(1) / DC2008 / Wafer table without stretcher
(1) / DC2308 / Wafer lift incl. wafer changer
(1) / DC350015 / Standard FoV SC (4,5 x 4,5 mm)
(1) / DC350017 / Standard FoV UC (4,5 x 4,5 mm)
(1) / DC4118 / Upgrade to heated bond head
(1) / DC4308 / Tool changer unit 7 slots
(1) / DC4318 / Upgrade tool changer unit to 14 slots
(1) / DC4008 / Flip chip station for C-type TS
(1) / DC5008 / Single die ejection unit
(1) / DC5108 / Upgrade to multi die ejection carousel (requires DC5008)
(1) / DC600010 / MAIN - high performance p/t dispenser (PDS)
(1) / DC6408 / Slide fluxer 50x50 (incl. 1 cavity plate)
(1) / DC700010 / Safety labels in English
(1) / DC7708 / Ionizer right
(1) / DC7028 / Wafer ID-reader
(1) / DC7918 / Connection kit (tubes, fittings, cables)
(1) / DC800054 / Wafer mapping (file based)
Accessories:
(1) / DC0518 / P-part at MAIN axis
(1) / DC0528 / Heated p-part at MAIN axis
(4) / DC000013 / Customized substrate carrier
(1) / DC250001 / 2" WP-Adapter (8"-FF108) - 12 up - side clamp (std WT)
(1) / DC250003 / 2" GP-Adapter - (8"-FF108) - 12 up - (std WT)
(1) / DC250007 / Wafer magazine - 8" (FF108) 25 slots
(1) / DC250007 / Wafer magazine - 12" (FF123) 25 slots
(5) / DC4808 / Standard tool holder (without shank and tip)
(5) / DC4960 / Pick & place or epoxy stamping tools (off the shelf, no customizing)
(1) / DC450002 / Customized tool tip
(2) / DC550001 / Eject tool base D20
(2) / DC550001 / Eject tool base D30
(5) / DC5038 / Multi-pin kit for eject tools
(1) / DC600008 / add. MAIN - high performance auger dispenser
(1) / TOOLEVO / Standard tooling
(1) / DC700007 / Calibration, Lubrication kit
(1) / DC7938 / Bondforce sensor calibration kit
(1) / DC7968 / Calibration tool kit for C-type TS
Customized Features:
(1) / CMF000663 / Static 3x WP/GP Holder in combination with Squeegee and 14up toolbench
(1) / CMF000848 / Squeegee in combination with 14up Toolbench
(1) / CMF000830 / Camera System for Process inspection.
DATACON / BESI 2200 Evo Plus is a highly advanced die attacher equipment designed for precision assembly processes in semiconductor manufacturing. This cutting-edge machine combines state-of-the-art technology with industry-leading capabilities to ensure optimal performance and reliability in die bonding applications. BESI 2200 Evo Plus features a modular design that allows for flexibility and customization to meet the specific requirements of various production environments. This versatility enables the system to accommodate a wide range of applications, from standard die bonding to complex packaging solutions. One of the key highlights of DATACON 2200 Evo Plus is its high-speed and high-accuracy placement capabilities. The unit is equipped with advanced vision systems that enable precise positioning and alignment of the die, ensuring optimal bond quality and reliability. This level of precision is essential in semiconductor manufacturing processes where even the smallest misalignment can result in significant defects or performance issues. In addition to its superior placement accuracy, 2200 Evo Plus offers rapid throughput rates to meet the demands of high-volume production environments. The machine is designed to maximize efficiency and productivity, allowing manufacturers to achieve fast cycle times and increased output without compromising on quality. Furthermore, DATACON / BESI 2200 Evo Plus is equipped with advanced process control features that ensure consistent and repeatable results. The tool incorporates intelligent software algorithms that monitor and adjust various parameters in real-time to compensate for any variations or deviations during the assembly process. This proactive approach helps to minimize scrap rates and optimize yield rates, leading to cost savings and improved overall efficiency. Another key advantage of BESI 2200 Evo Plus is its user-friendly interface and intuitive operation. The asset is designed with the operator in mind, featuring a touch-screen display and easy-to-use controls that simplify programming and setup tasks. This user-centric design contributes to a shorter learning curve for operators and reduces the risk of errors or mistakes during operation. In terms of reliability and maintenance, DATACON 2200 Evo Plus is built to withstand the rigors of continuous production. The model is constructed with high-quality materials and components that ensure long-term durability and performance consistency. Additionally, the machine is designed for easy access and serviceability, allowing for quick maintenance and troubleshooting to minimize downtime and maximize uptime. Overall, 2200 Evo Plus represents a best-in-class solution for die bonding applications in semiconductor manufacturing. With its advanced technology, high-speed capabilities, precision placement, process control features, user-friendly interface, and robust reliability, this equipment sets a new standard for efficiency and performance in the industry.
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