Used DATACON / BESI 2200 Evo #293591378 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
![DATACON / BESI 2200 Evo Photo Used DATACON / BESI 2200 Evo For Sale](https://cdn.caeonline.com/images/datacon-besi_2200-apm_23496989.jpg)
![Loading](/img/loader.gif)
Sold
DATACON / BESI 2200 Evo is a die attach equipment designed to securely attach a die to an embedded package substrate or module. It is a high-speed, stand-alone die attach solution, ideal for larger volume production runs. BESI 2200 Evo is equipped with an integrated vision system and advanced process control, which provides repeatable performance and accurate placement of the die with respect to the substrate, even at high speeds. The unit is capable of attaching die with die sizes from 0.5mm to 9.2mm with speeds from 200 pieces per hour to 1,500 pieces per hour and is capable of both standard and 3-D placement. The machine is also capable of attaching die with pitch of 0.25mm, allowing for a wide range of applications. DATACON 2200 Evo incorporates an area imaging tool that is capable of recognizing patterns on the die and substrate, ensuring accurate placement. The asset is also designed to be easy to use, with a user-friendly touchscreen interface. The model is also designed to be highly reliable, requiring minimum maintenance. The equipment is capable of attaching alloy die down wires, as well as pre-soldered balls or studs, such as Sn/In/Ag and other alloys, as well as conductive adhesives. The system also supports advanced cycle control and monitoring, in order to ensure quality and repeatable performance. The advanced vision unit is also used to verify the die-attached position, ensuring that the die is completely aligned with the substrate. The advanced machine allows for the inspection of the die attachment process and can be used to identify inconsistent results. The advanced die attach tool is highly suitable for many applications, including automotive, consumer electronics, medical devices, and more. The asset is also capable of automatically attaching die for multi-chip modules, including flip chips, TSOPs and other packages. 2200 Evo die attach model is an innovative, high-speed equipment designed to ensure accurate die attach placement. Its advanced vision system, process control, and repeatable performance ensure reliable results, and its low maintenance requirements make the unit a cost-effective choice for a variety of production lines.
There are no reviews yet